Chipset companies tackle open RF
Major chipset companies including Samsung, MediaTek, Broadcom and Intel teamed up to develop a framework for open RF interfaces, though important cooperator Qualcomm was absent from the effort.
Working together as the Open RF As, the companies aim to create conditions for standardized core chipset features and interfaces.
OpenRF argued access to interoperable platforms will offer device manufacturers cost, performance and supply chain benefits.
VP of marketing for Broadcom’s wireless semiconductor division, David Archbold, added it will also help “streamline and condense the OEM’s design cycle,” cutting time-to-market.
Other founding members include Murata Manufacturing and Qorvo. However, Qualcomm was not on the list, a glaring omission given the company in July claimed more than 660 device designs were based on its range of 5G chipsets.
At the time, Qualcomm CEO Steve Mollenkopf said “virtually all” of those were paired with its RFFE products.
Qualcomm is involved in other open standards efforts: President Cristiano Amon said in September the company was working on open RAN kit, but would reveal details at a later date